Module Development Engineer- Hybrid Bonding
Intel is a leader in semiconductor manufacturing, dedicated to innovation and technology that improves lives. The Module Development Engineer will focus on equipment performance and product quality, engaging in maintenance, process improvement, and technical support within high-volume manufacturing settings. Responsibilities Owning execution of maintenance and repair activities for equipment and relevant module of components Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required Engaging in hands-on training and development activities, managing process equipment and hardware, ensuring optimal functionality and availability Owning process development line items aligned to high volume process nodes Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites Assessing, improving, and optimizing processing techniques and methods used in high-volume manufacturing settings, ensuring safety and quality standards are met Improving safety, maintenance, and operational procedures for engineers and technicians Providing expert technical support to manufacturing operations, aiding in the resolution of complex issues through comprehensive analysis of variable factors Owning New Product Introduction, leading integration of new technologies, ensuring seamless transitions Owning development and optimization of excursion prevention systems for the equipment and process During factory ramps, owning equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes) Skills MS Degree in mechanical engineering, Electrical and/or Electronic Engineering, Chemical Engineering, Computer Engineering, or related STEM field Interested in fab process with database experience and analysis knowledge in Excel, JMP, Power Query, SQL, MATLAB, SOLIDWORKS, JMP, Power BI, Arduino, C++, Python, MES Technical knowledge in statistical process control, commonality analysis, design of experiment and failure modes/effects analysis (FMEA) Strong analytical and problem-solving skills Excellent communication and teamwork abilities Able to work onsite in Ronler Acres facilities in Hillsboro, OR Eagerness to learn and adapt in a fast-paced environment Graduates with up to 2 years of relevant experience; prior experience in the semiconductor industry and a manufacturing environment will be considered an advantage Benefits Health Retirement Vacation Competitive pay Stock Bonuses Company Overview Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. It was founded in 1968, and is headquartered in Santa Clara, California, US, with a workforce of 10001+ employees. Its website is Company H1B Sponsorship Intel has a track record of offering H1B sponsorships, with 239 in 2026, 2793 in 2025, 3717 in 2024, 3576 in 2023, 4811 in 2022, 3359 in 2021, 1174 in 2020. Please note that this does not guarantee sponsorship for this specific role.