Advanced Packaging Technologist
Introduction
IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you'll join a team who invent what's next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make. IBM's product and technology landscape includes Research, Software, and Infrastructure. Entering this domain positions you at the heart of IBM, where growth and innovation thrive.
Your Role And Responsibilities
Uses deep advanced-packaging skills and experience to guide technical decisions across all aspects of advanced packaging research and development. Scope includes chiplet wafer-scale process integration, laminates, bond and assembly, failure analysis and reliability testing. Trains and mentors engineers in hardware fabrication and testing within a multi-disciplinary team of engineers and scientists. Designs experiments and analyzes data to draw high-level, high-impact conclusions that affect technical directions. Makes recommendations for equipment purchases and process operations. Participates in defining technology roadmaps and future areas of focus. Participates in writing proposals for funding. Implements systems for efficient hardware fabrication and process control. Innovates to find new solutions and processes in chiplet and advanced packaging technology.
Preferred Education
Doctorate Degree
Required Technical And Professional Expertise
10+ years of experience in advanced packaging technology and closely related areas
5+ years of team lead experience
5+ years of experience working with packaging companies and assembly-test facilities
Ability to drive joint development with tooling/material supplier ecosystem
Possess a track record of innovation and technical eminence
Preferred Technical And Professional Experience
15+ years of experience in advanced packaging technology and closely related areas
10+ years of team lead experience
5+ years of experience working with packaging companies and assembly-test facilities
Prior experience in driving joint development with tooling/material supplier ecosystem
Proven track record of innovation and technical eminence
Apply Now
IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you'll join a team who invent what's next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make. IBM's product and technology landscape includes Research, Software, and Infrastructure. Entering this domain positions you at the heart of IBM, where growth and innovation thrive.
Your Role And Responsibilities
Uses deep advanced-packaging skills and experience to guide technical decisions across all aspects of advanced packaging research and development. Scope includes chiplet wafer-scale process integration, laminates, bond and assembly, failure analysis and reliability testing. Trains and mentors engineers in hardware fabrication and testing within a multi-disciplinary team of engineers and scientists. Designs experiments and analyzes data to draw high-level, high-impact conclusions that affect technical directions. Makes recommendations for equipment purchases and process operations. Participates in defining technology roadmaps and future areas of focus. Participates in writing proposals for funding. Implements systems for efficient hardware fabrication and process control. Innovates to find new solutions and processes in chiplet and advanced packaging technology.
Preferred Education
Doctorate Degree
Required Technical And Professional Expertise
10+ years of experience in advanced packaging technology and closely related areas
5+ years of team lead experience
5+ years of experience working with packaging companies and assembly-test facilities
Ability to drive joint development with tooling/material supplier ecosystem
Possess a track record of innovation and technical eminence
Preferred Technical And Professional Experience
15+ years of experience in advanced packaging technology and closely related areas
10+ years of team lead experience
5+ years of experience working with packaging companies and assembly-test facilities
Prior experience in driving joint development with tooling/material supplier ecosystem
Proven track record of innovation and technical eminence
Apply Now